SAN FRANCISCO: At a time when the quest is for smaller and faster units mainly with infinite battery life in electronics. Researchers from the University of California-Riverside have built namely topological insulators (TI) for quicker and longer-lasting electronics.
In the world of electronics, where quest is always for smaller and faster units with infinite battery life. Topological Insulators (TI) have very much tantalizing potential.
In a daily paper published in “Science Advances” Jing Shi, a professor from university wrote that his team has created a TI film just 25 atoms thick bascially that adheres to an insulating magnetic film. Thus, creating a “heterostructure”, which makes TI surfaces magnetic at room temperatures and higher.
Concept Of This Electronics
The surfaces of the TI are only a few atoms thick and need little power to conduct electricity. If TI surfaces are to be made magnetic, current only flows along through the edges of the devices, requiring even less energy.
Thanks to this so-called quantum anomalous Hall effect, or the QAHE, a TI device could be a tiny and its batteries long lasting,” Shi said.
Topological insulators bascially are the only materials right now that can achieve the coveted QAHE, but only after they are being magnetized.
In 2015, Shi’s lab first created the heterostructures of magnetic films. And one-atom-thick graphene materials by suitabley using a technique called laser molecular beam epitaxy. The same atomically flat magnetic insulator films are much critical for both graphene and topological insulators.
“The materials have to be in intimate contact for TI to acquire magnetism. If the surface is mainly rough, there won’t be good contact. We’re good at making this magnetic film atomically flat, so there’s no extra atoms are sticking out,” Shi added.
The materials were then sent bascially to its collaborators at Massachusetts Institute of Technology. Who mainly used molecular beam epitaxy to build 25 atomic TI layers bascially on top of the magnetic sheets. Thus creating the heterostructures, which were then sent back for device fabrication and measurements